AGM SOC AG10KSDE176 (AG10K+MCU+SDRAM)
AG10KSDE176(+MCU)+SDRAM device is AG10KSDE176(+MCU) SoC bonded with 64MBit 32-bit 166MHz SDRAM die. EQFP-176 package is provided as industrial grade, is pin-to-pin compatible with AG16KSDE176(+MCU)+SDRAM.
MCU hard-IP is embedded within FPGA logic fabric, and all mcu internal IOs are connectable to device's IO pad, and/or internal FPGA's logic as user demands. MCU core, with usable code space up to 64 KByte RAM, is programmable through spiflash, and JTAG for testing purposes.
AGM SOC AG10KSDE176 (AG10K+MCU+SDRAM)
AG10KSDE176(+MCU)+SDRAM device is AG10KSDE176(+MCU) SoC bonded with 64MBit 32-bit 166MHz SDRAM die. EQFP-176 package is provided as industrial grade, is pin-to-pin compatible with AG16KSDE176(+MCU)+SDRAM.
MCU hard-IP is embedded within FPGA logic fabric, and all mcu internal IOs are connectable to device's IO pad, and/or internal FPGA's logic as user demands. MCU core, with usable code space up to 64 KByte RAM, is programmable through spiflash, and JTAG for testing purposes.
